Computational modeling of creep-based fatigue as a means of selecting lead-free solder alloys
The primary aim of this investigation was to understand the effect of temperature fluctuations on a number of various solder materials namely SAC105, SAC305, SAC405 and Sn–36Pb–2Ag. To achieve this objective, three different classic joint assemblies (a ball joint, a test specimen joint and finger lead joint) were modeled which provided the foundation for the creep and fatigue behaviors simulation. Anand’s viscoplasticity as a constitutive … Continue reading Computational modeling of creep-based fatigue as a means of selecting lead-free solder alloys